* BK21/eSSC SEMINAR *

normal>Thermal style=mso-bidi-font-weight:normal>Packaging of High Power LEDsline-height:200%>

mso-fareast-language:KO>

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Speaker : 신무환 박사[style=font-size:12pt; line-height:200%;>Semiconductor Thermal Design
Lab]

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Location : 물리학과 세미나실 (공학3동 201호)

》》Date
& Time : 1월 24일(수) 오후 15:30 ~ 17:00

lang=EN-US>Elang=EN-US style=font-size:12pt;>ffective thermal management in high power LEDs is still one of
critical issues for the realization of the devices for general illumination and
other applications which require high power operation. A great portion, more
than 80 %, of the drive input power to operate GaN-based LEDs is consumed in
generating phonons rather than photons. In this paperstyle=font-size:12pt; mso-fareast-font-family:바탕;mso-fareast-language:KO>,lang=EN-US style=font-size:12pt;> thermal packaging schemes바탕;mso-fareast-language:KO> will be discussedlang=EN-US style=font-size:12pt;> from the
package level to system level. In particular, style=font-size:12pt; mso-fareast-font-family:바탕;mso-fareast-language:KO>ceramic packages
with different paths of thermal dissipation were designed by using thermal
simulator which utilizes finite volume method. It was shown that the thermal
characteristics of the LED packages were strongly affected by the contact area
of thermal via in contact with LED chip rather than that in contact with the
ceramic mold. Multi-chip schemes are also analyzed for thermally efficient LED
packaging design.